Wednesday, May 4, 2011

SKYNET WATCH: Intel Unveils 3-D Chip Technology

SAN FRANCISCO—-In what it calls a radical shift in semiconductor technology, Intel Corp. said it will start fabricating a new breed of three-dimensional transistors. The company says the next generation of its widely used microprocessor chips will break from the standard practice of creating circuitry in two dimensions on silicon wafers. Instead, Intel plans to fabricate transistors that rise up vertically from a wafer's surface, an approach that's similar to the way high-rise buildings pack more office space in a city.

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